Request a Quote from Syagrus Systems
Syagrus Systems

Request For Quotation

Are you interested in a quotation from Syagrus Systems? Please complete the appropriate sections on the form below or feel free to contact our office. This information will only be used to provide the requested feedback and information about Syagrus Systems to the requester.

For RFQ's, please note that pricing will be "per unit of shipment". For example, if product is shipped back in wafer form, the pricing will be noted as a per wafer price. If return shipment is individual die form, then the pricing will be noted as per die price.

Contact Information
* Required Fields   
* Full Name:
* Company: 
Street Address:
City:
State:
Zip:
Country:
Phone:  
Fax:
Ext:
* Email Address:
Product / Project Information
Product or
project id name:
Material:
If "Other" Please Specify:
Material Form:
shipped to Syagrus Systems in:
If "Other" please describe:
Substrate size:
Other size desc:
Substrate Thickness:  
bump height if app.  
Estimated number of devices per wafer:  
Estimated Volumes for This Product:
Please provide a quotation for the following services:
Backgrinding Dicing Inspection Die sort
(please complete as much information as possible in applicable sections)
Process Specific Information

Backgrinding

  
Final target thickness
of substrate:
Total thickness variation spec (TTV) if applicable:
of substrate:
Any backside metallization?
Please describe:
Special comments
on grind:

Dicing

  
Die size (L x W):
Scribe street width:
If die sort is not required, preferred return packaging method is:
Special comments on saw:
Inspection
Electrical defect data input:  
Commercial (gross chips, scratches, bump damage, etc)
MIL STD 883 method 2010  
 
Inspection criteria:  
Ink dot
Wafer map
Paper Map
None, inspect all devices
 
Visual defect data output:  
Please provide die sort
Please provide ink dots
Please send wafer map file
 
Top side inspection requirement:  
100% inspection all devices
Sample: Sample size or AQL level:
 
Die edge inspection requirement: (only applicable if die sorted from wafer):
ICS standard sample plan
Sample: Sample size or AQL level:
 
Die Sort
Electrical defect data input: Ink dot Wafer map Paper Map None, pick all devices
Package in: Chip Tray Gel Pak Embossed carrier tape Surf Tape
Other requirements? Vacuum seal Dry packaging