Request Quote Form - Die/Wafer Level Processing


Are you interested in a quotation from Syagrus Systems? Please complete the appropriate sections on the form below or feel free to contact our office. This information will only be used to provide the requested feedback and information about Syagrus Systems to the requester.

For RFQ's, please note that pricing will be "per unit of shipment." For example, if product is shipped back in wafer form, the pricing will be noted as a per wafer price. If return shipment is individual die form, then the pricing will be noted as per die price.

Required Fields *
Contact Information:
Full Name: *
Company: *
Street Address:
City:
State:
Zip Code:
Country:
Phone:
Fax:
Ext:
Email: *
Product/Project Information:
Product Name or Project ID:
Material:
Material Form:
If "Other," Please Describe:
Substrate Size:
Substrate Thickness:
Bump Height if Applicable:
Estimated Volumes for this Product:
Please Provide a Quotation for the Following Services:
Services:




Please provide as much information as possible in the following sections.
Process Specific Information:
Backgrinding:
Final Target Thickness of Substrate:
Total Thickness Variation Spec (TTV) if Applicable:
Any Backside Metallization?
Please Describe:
Special Comments on Grinding:
Dicing:
Die Size (L x W):
Scribe Street Width:
Special Comments on Saw:
Inspection:
Inspection Criteria:
Electrical Defect Data Input:


Top Side Inspection Requirement:
Die Edge Inspection Requirement:
(only applicable if die sorted from wafer)

Die Sort:
Electrical Defect Data Input:


Package In:


Other requirements?
Validation Code *