Silicon Wafer & Semiconductor Wafer Industries Served

Silicon wafers are a key component of semiconductor and integrated circuit manufacturing.  Tech companies and OEMs across a broad spectrum of industries use this technology in their products, from smartphones to sophisticated weapon systems.  All industries and applications have different requirements. Working with a company highly experienced in silicon wafer processing and post-fabrication is critical for successful product development.

Full-Service Silicon Wafer Processing

Syagrus has the capabilities and the experience to process your silicon and semiconductor wafers to your unique specifications, quickly and efficiently. We work with everyone from OEMs to university research students and faculty to produce ultra-thin wafers and semiconductors. Whether you are in the R&D stages or need semiconductors for product manufacturing, you can trust us to deliver exceptional quality, precision, and customer service.

We are an ISO 9001:2015 certified and ITAR registered facility serving all segments of the semiconductor industry. Our wafer processing services include:

• Wafer Bonding
• Wafer grinding
• Wafer dicing
• Wafer Polishing
• Inspection
• Die Sort and Pick and Place
• Surface Mount Device Tape & Reel Service
• Additional Capabilities

Wafer Thinning and Processing for Military & Aerospace

Many of the leading military contractors in the United States choose Syagrus Systems for post fab processing of silicon wafers and semiconductor wafers. Specialty services include MEMS device wafer thinning, ultrathin wafer dicing and backgrinding for RF chip applications, and stress-free flexible silicon wafer processing. We process wafers for wearable electronics for pilots and soldiers, weapons and surveillance systems, airplane controls and sensors, UAVs (drones), and other sophisticated applications.

Wafer Processing for Medical Electronic Products

We work with some of the country’s largest medical electronics manufacturers, providing post-fabrication silicon wafer and semiconductor wafer processing for pacemakers, defibrillators, and other advanced medical equipment. All wafer backgrinding processes are performed in our Class 10K cleanroom to maintain extremely high levels of quality and care required by medical device OEMs.

Wafer Processing for RFID Communications

Ultrathin wafer processing for RFID communications is one of our specialties. These tags are used in an ever-expanding range of applications, including supply chain management, inventory management, materials management, tool tracking, and personnel tracking. Few others in our industry are capable of backgrinding, dicing, and processing ultrathin wafers at all, let alone doing so with the care and precision that we provide.

Ultrathin Wafers for Telecommunications & Commercial Electronics

As telecommunications devices and commercial electronics become smaller and more powerful, ultrathin wafers are growing in importance. We specialize in ultrathin silicon wafer and semiconductor wafer backgrinding, dicing, and post-fabrication for smartphones, fiber optic receivers, and everything in between.

Semiconductor and Wafer Processing for Scientific Universities

Some of America’s leading research and scientific universities use our silicon wafer processing and semiconductor wafer processing services. We have worked with scientific departments and students from MIT, Georgia Tech, USC, UCLA, Virginia Tech, Auburn, the University of Illinois, UC Santa Barbara, UC Berkeley, Notre Dame, Perdue, Duke, and many others. We welcome all students and faculty to ask us about silicon wafer processing for their research projects.

Contact Us to Discuss Your Silicon and Semiconductor Wafer Requirements

We work with all industries. Learn more about our wafer processing and post-fabrication options or contact us to discuss your specific requirements.