Wafer Backgrinding & Silicon Wafer Thinning
Have a Wafer Backgrinding Project Coming Up?
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Wafer grinding, also called wafer thinning, is a process performed during the semiconductor manufacturing to reduce wafer thickness. This manufacturing step is essential in producing the ultra-thin wafers required for stacking and high-density packaging in portable and handheld devices.
Silicon Wafer Thinning Processes for the Electronics Industry
The back grinding process involves using a diamond-resin bonded grinding wheel to remove the silicon material from the back of a silicon wafer. Using a grinding wheel is highly effective, and faster and less expensive than chemical-mechanical processes, and is used to remove the bulk of substrate material prior to final finish grind, polish or chemical etch.
Wafer backgrinding starts with a large grit wheel to remove most of the surface, and wheels with a finer grit are used to finish polishing the silicon wafer to the desired thickness. To prevent contamination, deionized water is used to wash debris from the surface throughout the wafer thinning process. The use of protective tape also helps prevent breakage and damage to the wafer front surface during the back grinding and post-thinning processes to allow the creation of ultra-thin wafers.
Full-Service Wafer Backgrinding for Semiconductor and Electronic Manufacturing
Wafer backgrinding is an effective and time-efficient method of reducing silicon wafer thickness for use in semiconductor manufacturing applications. Whether you have one wafer or many thousands of wafers that require thinning or backgrind services, we have the right wafer thinning solution for your project.
Our custom backgrinding and wafer thinning service can handle a wide variety of customer requirements, such as thinning partial wafers or single die. We also offer post-grind stress relief processes such as SEZ etch and CMP.
Because timing is critical, we have streamlined our wafer thinning process so that you can enjoy same-day, 24-hour, or 48-hour cycle times.
Details of our wafer backgrinding & wafer thinning services:
- Fast cycle times with same-day service available
- Thin wafers from 4" to 8" diameter
- Ultrathin wafer backgrinding to target thickness of 0.025mm (0.001")
- Single die backgrinding
- Partial wafer backgrinding
- Bumped wafer backgrinding
- Thickness variance under 5 microns
- Ultra-fine grind wheels to obtain low-stress polish or mirror-like finish
- Wide selection of grinding tapes
- Use our engineering staff for your engineering and prototype runs
- Safe, damage resistant packaging to support thin wafer shipping
- Class 10k cleanroom environment
Syagrus Systems can take your thin wafer all the way to singulated die form. We provide complete, professional wafer dicing service, automated die visual inspection service, and wafer die sort services.
Precision Wafer Grinding & Wafer Thinning Services
We use fully-automated Disco and Strasbaugh wafer backgrinding equipment to achieve the highest possible level of quality and can continuously achieve thin wafer target thicknesses to less than 0.050mm (0.002”). Achieving these ultra-thin thicknesses requires a grind wheel with extremely fine diamond grit. This ultra-fine grind wheel is our standard for all backgrind target thicknesses and is superior to industry-standard 2000 grit. *Other grind wheel options are available upon request.
We Provide Fast and Cost-Effective Wafer Backgrinding
All wafer backgrinding is performed in a class 10K cleanroom with critical thin wafer taping processes performed at a class 100 workstation. UV curable or standard adhesive backgrinding tape temporarily adheres to the surface of a silicon wafer to protect the surface from damage during grinding and other processes. The tape also helps prevent silicon wafers from breaking during processing to increase yields and keep costs low.
We stock a wide variety of tapes or bonding solution for wafer thinning to ensure we'll have the correct surface protection for your application.
Contact Syagrus today to learn more about our Wafer Back Grinding Process
Syagrus Systems uses the 3M Wafer Support System to meet the demands of today's technology companies for extremely thin silicon wafers and die used in complex applications. We have over 15 years of silicon wafer thinning and wafer backgrinding experience, including bumped wafer backgrinding and have provided wafer backgrind services since 1997.
Check out other additional wafer services offered by Syagrus
- Wafer Dicing
- 3M Wafer Support System Wafer Bonding
- Surface Mounting Device Tape and Reel Service
- Wafer Polishing
Let us help you with your next back grinding wafer project
Contact Us Syagrus Systems today for your next Wafer Grinding Project.