Silicon Wafer Backgrinding & Wafer Thinning Services
Wafer backgrinding, or wafer thinning, is a semiconductor service designed to reduce wafer thickness. This complex manufacturing process produces ultra-thin wafers for stacking and high-density packaging in compact electronic devices.
Syagrus Systems is an experienced provider of wafer grinding services. Our engineers can achieve your desired thickness and surface smoothness without damaging or compromising the strength of your silicon wafers. We use the 3M™ Wafer Support System to meet demands for extremely thin silicon wafers and die used in complex applications. Whether you have one or several thousand silicon wafers that require thinning or back grinding, we have the right solution for your project. Our capabilities include:
- Thin wafers from 4” to 8” diameter
- Backgrinding to target thickness of 0.025mm (0.001”)
- Single die, partial wafer, or bumped wafer backgrinding
- Thickness variance under 5 microns
Syagrus Systems can take your thin wafer all the way to singulated die form through our comprehensive silicon wafer services. Contact us today to learn more about our abilities and wafer thinning processes. Request a quote to start your order.
Wafer Backgrinding & Wafer Thinning Processes Deliver Quality
Silicon wafer backgrinding uses a diamond-resin bonded grinding wheel to remove the silicon material from the back of a wafer. This process is effective, fast, and less expensive than chemical-mechanical alternatives, efficiently removing the bulk of substrate material before the final finish grind, polish, or chemical etch. Throughout the wafer grinding process, deionized water is used to wash debris from the surface and prevent contamination.
UV curable or standard adhesive backgrinding tape is temporarily applied to protect your silicon wafers from damage during wafer grinding. We stock a wide variety of backgrinding tapes for wafer thinning to ensure we’ll have the correct surface protection for your application.
The Advantages of Choosing Syagrus Systems for Wafer Thinning
All Syagrus Systems’ wafer backgrinding is performed in a class 10K cleanroom with critical thin wafer taping processes performed at a class 100 workstation. As an ISO 9001:2015 certified manufacturer, we work hard to continuously improve our processes to produce high-quality increased yields for the lowest cost possible. We also provide many other advantages, such as:
- Fast cycle times with same-day service available
- Wide selection of grinding tapes
- Grind wheels that exceed the industry standard of 2000 grit
- Engineering staff at your disposal for engineering and prototype runs
- Safe, damage-resistant packaging to support thin wafer shipping
Contact Syagrus Systems to Learn More About Our Silicon Wafer Services
Syagrus Systems uses our state-of-the-art wafer back grinding processes to give you a leading edge over your competition. Our decades of engineering experience have prepared us to meet the demands of most industries. We always follow our own strict in-house quality protocols, including visual inspections, while meeting your necessary requirements to ensure you only receive the best results. In addition to wafer grinding, we also offer:
- Wafer Bonding
- Wafer Polishing
- Wafer Dicing
- Surface Mount Device Tape and Reel
- And many other capabilities.
Ready to learn more about how Syagrus Systems can support your semiconductor and electronic manufacturing operations? Request a quote on wafer thinning and backgrind services or contact us for more information.