Additional Wafer Capabilities

 

To complement our wafer backgrinding, wafer dicing, and other wafer processing services, we offer several additional capabilities. These secondary wafer thinning services help us deliver silicon wafers that better match the requirements of our customers, reducing or eliminating the need for further processing—we do more of the work, so you don’t have to.

 

Contact us for more information on our additional wafer capabilities, or request a quote today.

 

SEZ® Etching Process - Back End of the Line

Performed following the wafer backgrinding process, SEZ substrate etching provides silicon removal from the back of the wafer and eliminates subsurface micro damage created by the grinding wheel. Specially engineered to provide optimum uniformity control, repeatability, and selectivity to underlying materials, this etching process results in an ultra-thin wafer with a uniform, stress-free surface. This back-end-of-the-line (BEOL) process includes:

 

  • Post-ash clean
  • Backside/bevel etch/clean
  • Substrate etch

 

SEZ® Wafer Thinning Benefits - Back End of the Line

Silicon thinning, and stress relief are increasingly significant in the back end of the line and assembly areas of semiconductor component manufacturing. There are numerous benefits associated with the SEZ® post wafer backgrinding etching process. These SEZ® silicon removal substrate etching benefits, include:

 

  • Increased wafer & die strength
  • Removal of surface damage
  • Removal of crystal effects caused by wafer backgrinding
  • Removal of microcracks due to wafer backgrinding

 

Contact us for more information on our back end of the line wafer thinning benefits, or request a quote today.

 

Post-Metallization Annealing

  • Wafer size up to 200mm
  • Atmospheric, vacuum, inert, and forming gas (up to 15% H2)
  • Want to Learn More About Post Metallization Annealing and how it can benefit your company? Contact Syagrus Systems Today

 

Syragus Systems’ offers a broad range of wafer services including: wafer semiconductor dicing, wafer grinding and wafer polishing. Each of these wafer services provides unique benefits depending on your overall project needs.

 

Semiconductor Dicing

When it comes to dicing semiconductor wafers Syragus Systems’ relies on the highly accurate double pass cutting system. Our semiconductor dicing services can dice silicon and semiconductor wafers as thin as 0.020mm (0.0008”) and up to 200mm (8.0”) in diameter with exceptional precision and perfect repeatability. Our dicing of semiconductor wafers can also be performed on previously singulated multi-die reticles and partial wafers.

 

Wafer Grinding

Syragus Systems’ uses wafer grinding services to achieve thin wafer target thicknesses to less than 0.050mm (0.002”). This thickness level is accomplished using our ultra-fine grind wheels, which are superior to industry standard 2000 grit wheels. This type of wafer grinding is regularly provided using fully-automated Disco and Strasbaugh wafer backgrinding equipment, which provides the highest possible level of quality.

 

Wafer Polishing

Syragus Systems’ wafer polishing methods eliminate subsurface damage caused by wafer thinning grinding methods. This damage is most often only a few microns deep, but it should be removed to create a stronger more flexible wafer and die.

 

One common method to remove this damage is through Chemical Mechanical Planarization (CMP), also often referred to as wafer polishing. Post backgrind wafer polishing removes between 5 and 10 microns of silicon from the back side of the wafer. This results in the dramatic reduction of damage due to the micro-sized peaks and valleys caused by the backgrinding process.

 

Contact us for more information on our semiconductor dicing, wafer grinding and wafer polishing services, or request a quote today.

 

Backside Metal Deposition, Sputtering & Evaporation

Syragus Systems’ also provides metal deposition, sputtering and metal evaporation services for your project needs. These highly technical processes use thin film deposition, physical vapor deposition or CAD data designs to create their desired effects. Backside metal deposition, sputtering and evaporation utilizes the following metals:

  • Platinum
  • Nickel
  • Gold
  • Copper

 

Backside Metal Deposition

Backside metallization is required for many high-performance applications like power devices, microprocessors, laser diodes where backside contacts are needed for subsequent die attach. Precise control of pre-clean and deposition processes is very important for excellent thermal, electrical and mechanical properties. This process is often done on very thin and fragile wafers, so the ability to control stress and handling the wafers is very critical.

 

Sputtering Deposition

Sputtering is the physical vapor deposition (PVD) method of thin film deposition. This process involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Sputtering deposition is highly advantageous since even materials with very high melting points are easily sputtered, while evaporation of these materials in a resistance evaporator can be close to impossible.

 

Contact Syagrus Systems Today

At Syragus Systems we carry a large inventory of chip trays and waffle packs for your wafer carrier system needs.

 

Our silicon dies can be delivered in a tray which is also known as waffle pack, which is a plastic tray with pockets that match the die size. A waffle pack has a lid and is delivered in an antistatic bag. Waffle packs are ideal for delivering small number of silicon dies, typically from a MPW process. Some of the other wafer chip tray delivery methods that we offer, include

 

  • Waffle pack trays
  • Wafer chip trays
  • Gel packs
  • Wafer cassettes
  • Tape and reel

 

Contact us for more information on our chip trays and waffle packs for your wafer carrier systems, or request a quote today. 

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