Additional Wafer Capabilities
To complement our wafer backgrinding, wafer dicing, and other wafer processing services, we offer a number of additional capabilities. These secondary services help us deliver silicon wafers that better match the requirements of our customers, reducing or eliminating the need for further processing—we do more of the work so you don’t have to.
Syagrus SEZ® Etching Process - Back End Of the Line
Performed following the wafer backgrinding process, SEZ etching removes additional silicon from the back of the wafer and eliminates subsurface microdamage created by the grinding wheel. Specially engineered to provide optimum uniformity control, repeatability, and selectivity to underlying materials, this process results in an ultra-thin wafer with a uniform, stress-free surface. This back-end-of-the-line (BEOL) process includes:
- Post-ash clean
- Backside/bevel etch/clean
- Substrate etch
- Wafer size up to 200mm
- Atmospheric, vacuum, inert, and forming gas (up to 15% H2)
- Want to Learn More About Post Metallization Annealing and how it can benefit your company? Contact Syagrus Systems Today
- SEM, FIB, XRF, EDS, AFM
Compound Semi Dicing, Grinding & Polishing
- 0.25" (6.35mm) to 8" (200mm) flexible wafer dicing workspace capable of sawing multi-die reticles
Contact Syagrus with any questions on secondary wafer services today!
Contact Syagrus Systems today for more information on our secondary wafer processing services.