Request Quote Form - Die/Wafer Level Processing

Are you interested in a quotation from Syagrus Systems? Please complete the appropriate sections on the form below or feel free to contact our office. This information will only be used to provide the requested feedback and information about Syagrus Systems to the requester.

For RFQ's, please note that pricing will be "per unit of shipment." For example, if product is shipped back in wafer form, the pricing will be noted as a per wafer price. If return shipment is individual die form, then the pricing will be noted as per die price.

Required Fields *
Contact Information:
Name *
Company *
Street Address
City
State
Zip Code
Country
Phone
Fax
Ext
Email *
Product / Project Information:
Product Name or Project ID
Material
Material Form
If Other Please Describe
Substrate Size
Substrate Thickness
Bump Height if Applicable
Estimated Volumes for this Product
Please Provide a Quotation for the Following Services:
Services
Please provide as much information as possible in the following sections.
Process Specific Information:
Backgrinding:
Final Target Thickness of Substrate
Total Thickness Variation Spec (TTV) if Applicable
Any Backside Metallization? Please Describe
Special Comments on Grinding
Dicing:
Die Size (L x W)
Scribe Street Width
Special Comments on Saw
Group Inspection:
Inspection Criteria
Electrical Defect Data Input
Top Side Inspection Requirement
 
Die Edge Inspection Requirement (only applicable if die sorted from wafer)
Die Sort:
Electrical Defect Data Input
Package In
Other Requirements?
Validation *