Silicon Wafer Polishing
Semiconductor wafer polishing, also called Chemical Mechanical Polishing or CMP, removes between 5 and 10 microns of silicon from the backside of a wafer to dramatically reduce the peaks and valley micro-damage left behind by other silicon wafer processes. CMP removes stresses and prevents warping that weakens wafers, giving you an improved semiconductor wafer.
Syagrus Systems specializes in wafer polishing and post-backgrind relief. Our silicon CMP process prepares your wafers for additional services and is ideal for electronic applications requiring flexible circuits. Our in-house capabilities allow us to polish and etch ultra-thin silicon wafers without causing stress or damage to achieve higher yields. Wafer polishing services include:
- Free-standing silicon wafer, fused silica wafer, and glass wafer polishing
- Bonded wafer stack polishing using the 3M™ Wafer Stack Support System
Wafer Polishing Processes for High Yields
Semiconductor wafer polishing is highly effective and safe for removing stresses and surface damage. Our CMP process uses polishing pads and diamond liquid slurry to polish the wafer. A vacuum carrier holds the wafer in place while leaving the backside exposed. The carrier and wafer are slowly brought into contact with a rotating platen covered with a polishing pad. With a controlled downward force, we carefully remove damaged wafer layers.
Syagrus Systems is dedicated to providing wafer polishing processes that produce silicon semiconductor wafers that meet or exceed your standards, such as accommodating your specific surface roughness requirements. While keeping the wafer damage-free is challenging, our team has the expertise to conduct CMP processes that remove unwanted surface roughness without harming your semiconductor wafers.
Safe and Effective Post-Backgrind Silicon CMP Process
The Advantages of Silicon Wafer Polishing for Semiconductor Manufacturers
Electronic devices across industries get smaller and thinner with each new generation, which means ultra-thin wafers are more in demand than ever. Wafers thinned using conventional wafer grinding methods often have a mirror-like surface with subsurface damage hidden from the naked eye. While this damage may only measure a few microns, it will impact your semiconductor’s performance and abilities. By incorporating a CMP process into your semiconductor wafer production, you can ensure that you receive a stronger result that operates as designed. Wafer polishing also adds other advantages to your final product:
- Boosted throughput
- Lessened level of surface contamination
- Elimination of any residual slurry
Contact Syagrus Systems to Learn More About Our Silicon Wafer Services
Syagrus Systems is an ISO 9001:2015 certified provider of full-service solutions for semiconductor wafer production. We follow strict quality control protocols on every order, completing your services in a 10K cleanroom to eliminate the risk of contamination. Our top goal is your complete satisfaction, and we provide quick cycle times to help you transition from engineering projects to full production ramp-up. In addition to silicon wafer polishing, we also offer:
- Wafer Backgrinding
- Wafer Dicing
- Wafer and Die Visual Inspection
- Surface Mounting Device Tape and Reel