Silicon Wafer Services >> Silicon Wafer Dicing

Silicon Wafer Dicing Services

Wafer dicing is a precision process where semiconductor wafers are cut into small square or rectangular “chips” or “die.” Syagrus Systems is known for our high wafer dicing standards. Many leading semiconductor, military, and medical device manufacturers trust us to deliver defect-free die for their automated assembly operations. Quality and precision are critical in silicon and semiconductor wafer dicing, setting the pace for all remaining post-fab operations.

We use state-of-the-art, dual spindle dicing saws to produce clean, precision cuts. Our expert team adheres to strict quality assurance processes to ensure each wafer dicing stage turns out cleaner wafers, minimizes distortions, and reduces material loss to create higher yields. Contact us or request a quote to learn more about how we can support your operation through our precision wafer dicing processes. At Syagrus Systems, no job is too big or too small.

Precision Wafer Dicing Capabilities

Our fully automated silicon wafer dicing capabilities are designed to meet and exceed your specifications. We utilize double pass cutting as a standard practice to provide excellent results with extreme accuracy. After wafer dicing is finished, we use high magnification die visual inspection to ensure your wafer is at peak optimization. We offer complete prototype and production support from our technical staff. Other capabilities and advantages include:

  • All wafer dicing performed in a Class 10K cleanroom environment
  • Same day cycle time available
  • 0.25” (6.35mm) to 12” (300mm) flexible wafer dicing workspace capable of sawing multi-die reticles
  • High-precision wafer dicing for singulated devices as small as 0.006” (0.2mm) and wafers as thin as 0.0008” (0.020mm)
  • Bumped and non-bumped wafer dicing processes
  • Surfactant available

Our technical staff is available as needed to assist with your engineering and prototype questions.

Silicon Wafer Dicing Processes

The first step of the silicon wafer dicing process involves mounting the wafers on dicing tape that secures the wafer to a metal frame. Next, we cut the wafers with a high-speed wafer saw, leaving behind singulated dice (or dies). Finally, we inspect the wafer dies, remove them from the tape, and frame them via pick and place. Our versatile equipment and systems also accommodate several specialty precision wafer dicing processes:

  • Multi-die or “pizza-mask” wafers
  • High-volume or low-volume cutting programs
  • Wafer dicing operations on previously singulated multi-die reticles and partial wafers


Syagrus Systems High Precision Wafer Dicing Process

Full-Service Silicon Wafer Processing Solutions


Silicon wafer dicing is available as an individual process or a full-service solution paired with our other high-quality precision wafer processing services. Depending on your production and goals, your solution could include:


Wafer Dicing to Meet Your Industry’s Standards

While our precision wafer dicing services are most often utilized by semiconductor and integrated circuit manufacturers, our products and services are prepared to meet the needs of most industries:

  • Military and Aerospace
  • Medical Electronics
  • RFID Communications
  • Telecommunications and Commercial Electronics
  • Scientific Universities and Research Laboratories


Contact Syagrus Systems for Precision Silicon Wafer Dicing & Processing

Syagrus Systems provides world-class post-fab processing for silicon wafers and semiconductor wafers, with wafer dicing processes customizable to your unique needs. As an ISO 9001:2015 certified wafer dicing manufacturer, we are dedicated to continuously improving our precision processes to give you a competitive edge.

Request a quote on wafer dicing and wafer cutting, or contact us for more information.