Silicon Wafer Dicing

 Silicon wafers are used in semiconductor manufacturing and for producing chips or microchips for computers and other electronic devices. Manufacturing chips and microchips involve cutting the wafers into small square or rectangular “chips” or “die”, using a process known as silicon wafer dicing.

During the silicon wafer dicing process, the wafers are mounted on dicing tape that secures the wafer to a metal frame. A high-speed wafer saw then cuts the wafers, leaving behind small pieces referred to as dice or dies. The wafer dies are inspected and unloaded from the tape and frame via pick and place process, so the chips or die can be packaged or placed on a PCB.  

Fully Automated Silicon Wafer and Semiconductor Wafer Dicing Capabilities

Syagrus Systems’ fully automated silicon wafer and semiconductor wafer dicing capabilities consistently meet or exceed our customers’ high standards. Good wafer dicing or wafer cutting process sets the pace for all remaining post fab operations. Saw speed, cut quality, and cut placement accuracy are monitored regularly throughout the process, and we perform all wafer dicing in a Class 10K cleanroom environment to protect your products.

With a large variety of dicing saw blades and dicing tape at our disposal, we can optimize the wafer dicing process to achieve optimal yields for your critical devices.

High Precision Silicon Wafer Dicing and Post Fab Processing

Double pass cutting provides the highest quality and most accurate silicon wafer dicing and is our standard practice. This wafer dicing process allows us to dice silicon and semiconductor wafers as thin as 0.020mm (0.0008”) and up to 300mm (12.0”) in diameter with exceptional precision and perfect repeatability.

Our versatile wafer dicing systems give us the flexibility to accommodate multi-die or "pizza mask" wafers, as well as high volume cutting programs. We can also perform wafer dicing operations on previously singulated multi-die reticles and partial wafers. Our technical staff is available as needed to assist with your engineering and prototype questions.

We offer high magnification, fully-automated, die visual inspection to ensure your wafer is at peak optimization following the wafer dicing process. Other post fab processing services including wafer backgrinding,  wafer polishing, and surface mounting device tape and reel service are also available upon request.

Syagrus Systems is known for our high wafer dicing standards, and many leading military and medical device manufacturers trust us to deliver defect-free die for their automated assembly operations. Our team takes pride in providing customized silicon wafer dicing services for customers across the United States and all around the world. No job is too big or too small!

Wafer Dicing and Cutting Details

  • All wafer dicing performed in Class 10K cleanroom environment
  • Same day cycle time available
  • 0.25" (6.35mm) to 12" (300mm) flexible wafer dicing workspace capable of sawing multi-die reticles
  • High precision wafer dicing for singulated devices as small as 0.008" (0.2mm) and wafers as thin as 0.0008" (0.020mm)
  • Bumped and non-bumped wafer dicing processes
  • A large variety of wafer dicing blades and dicing tape available to handle all customer requirements
  • Surfactant available
  • Return shipment on saw frame or stretch rings, or continue to follow up inspection and die sorting
  • Full prototype and production support from our technical staff

Syagrus Systems High Precision Wafer Dicing Process

Contact Syagrus Today to Learn More About Our Wafer Dicing Process 

Syagrus Systems provides world-class post fab processing for silicon wafers and semiconductor wafers, with wafer dicing processes that are customizable to your unique needs. Request a quote on wafer dicing and wafer cutting, or contact us for more information.

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