Die Sort or Pick and Place Services
Known good die (KGD) are an essential component of the semiconductor manufacturing process for portable electronics. Production demand is high, resulting in the need for high production yields. Despite a manufacturer’s best efforts, not all chips on a wafer are functional. Die on the same wafer can also have differing characteristics.
Die sorting, or pick and place, is a process that helps you achieve higher yields by inspecting electrically good die for visual defects, then separating and sorting the passing die from failing die. die based on their characteristics. Instead of discarding wafers with bad die, pick and place allows you to harvest only known good die and prepare them for future automated manufacturing processes. mismatched die, all the sorted die are grouped and mounted onto new wafers for future use.
Wafer sorting involves the use of manual or automated wafer pick and place equipment to sort, mount, dice, and package die. The packaging options used vary depending on the application needs but typically include waffle pack, Gel-Pak®, or tape and reel.
Chip Tray/waffle pack, Surface Mount, and Gel Pak Services
Die sorting requires incredible precision to accurately place die in correct orientation, in preparation for future manufacturing of the end product. test and divide the die for packaging. You need a company that has the expertise to achieve the highest yield possible while providing a variety of packaging solutions to meet your size and output requirements.
Our trained personnel use automated and manual wafer sorting systems to achieve the best results and complete your project on time. Packaging is performed per customer requirements and offered in a variety of outputs, including:
- Chip Tray or Waffle Pack Services
- Gel Pak® Services
- “Chip On Tape” or COT, reconstituted wafer array
- Embossed Carrier Tape Surface Mount Device Tape and Reel Services
We also provide vacuum seal dry packaging, customized labeling, barcoding, and drop shipping services.
Ultra-Thin and Multi-Die Binning and Pizza Mask Wafer Die Sorting or “pick and place” Services
Syagrus Systems offers fully automated die sorting pick and place services to complement our wafer dicing and inspection processes. Whether you require high volume production or a single wafer prototype build, we have the die sorting solution for you.
We have over 20 years’ experience in processing flip chip devices, and our automated die sort systems have device invert capability, so your product is ready for automated manufacturing. Our die sorting systems can import wafer maps or work with ink dot recognition. We also specialize in Ultra-thin die pick and place. Wafers and die less than 50um in thickness.
Benefits of our wafer pick and place services include:
- 3" to 8" wafer diameter capability
- Fast turnaround time to get your product ready for final assembly
- Pizza Mask and engineering projects
- Inverting capabilities for bumped devices
- Large variety of pick tips and needle configurations in stock to handle various customer die sorting requirements
- Ink dot or wafer map input
- Embossed SMD tape and reel, Gel Pak®, and chip tray outputs
- Customized labeling
- Drop shipping
Contact Syagrus today to learn more about our Die Sorting Solutions
Syagrus has the capabilities and the experience in Die Sorting services to meet your unique specifications, quickly and efficiently. We also provide a range of other wafer services, including:
Contact us to learn more about our wafer sorting services and to discuss your pick and place packaging needs.