Silicon Wafer Bonding Services

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Silicon wafers are used to produce semiconductors for electronic devices. Semiconductor manufacturers and other users of silicon wafers need those wafers to be ultrathin, but, like anything, the thinner the wafers get, the more fragile they become. To reinforce silicon wafers and protect them against damage during conventional thinning and post-thinning processing operations, they are bonded to glass using a removable UV adhesive.

This process, known as temporary wafer bonding, offers an effective way to minimize stress on silicon wafers during processing. The temporary adhesive does not damage the wafer surface and peels away without leaving behind any residue.

Wafer Bonding Services for Ultra-thin Wafer Manufacturing

Syagrus Systems utilizes the 3M Wafer Support System for temporary wafer bonding. This method of wafer bonding was explicitly designed for semiconductor processes.  It is compatible with high temperature and high vacuum processes, as well as typical process chemistries and low-k dielectric materials. Wafer bonding minimizes issues such as warping, cracking, and edge chipping, leading to higher yields, high throughput, and reduced waste.

Our team is highly experienced in wafer bonding and other silicon wafer processes and uses the best technology and methods to deliver exceptional results. Once the temporary wafer bonding is applied, we can take your thin wafer to singulated die form. We provide highly efficient, highly effective wafer dicing servicesautomated die visual inspection serviceswafer die sort services, and more.

Light to Heat Conversion (LTHC) Coating Services for Silicon Wafers

Syagrus Systems also provides glass substrate coating services for silicon wafers. The Light to Heat Conversion (LTHC) layer is applied via a spin coating process and cured for use with the 3M WSS temporary wafer bonding process. We verify all glass substrates after coating for proper levels of light transmittal.

Request a quote for silicon wafer bonding services or contact us to learn more about our other silicon wafer production solutions.

Temporary Wafer Bonding Using the 3M Wafer Support System

The 3M Wafer Support System is a proven method of making ultrathin wafer manufacturing more reliable and more efficient. This temporary wafer bonding solution combines 3M bonding chemistries with state-of-the-art equipment designed specifically for wafer processing.

A special UV-curable adhesive, formulated specifically for temporary bonding of semiconductor wafers to glass, is the key component of the process. The 3M adhesive is spun onto the wafer surface and used as a bonding agent between the wafer and a glass carrier. This mounting process is performed under vacuum to ensure that no air bubbles or other voids are trapped between the wafer and the support glass.

The adhesive flows into and supports the topography of the circuit patterns on the front side of the wafer. This creates a uniform, rigid support surface that helps minimize stress on the wafer and allows for wafer thinning to less than 20µm final thickness.



Glass Substrate Support Protects Silicon Wafers During Processing

After wafer thinning, the glass substrate continues to provide support for post-grinding processes such as etch, CMP, or metal deposition. Because the wafer bonding process creates support for the entire face and the edges of the wafer, it results in less warpage, cracking, and edge chipping, and helps promote higher yields.

After wafer bonding and processing, a special laser is used to debond the glass carrier plate. This allows for easy, chemical-free separation using minimal force. No heat, wet chemistry or soaking are required to separate the silicon wafer from the glass substrate. The wafer bond adhesive can then be peeled from the wafer.

How the Silicon Wafer Bonding Process Works

1) Mount (Spin coat UV resin on wafer; vacuum bond to support glass; UV irradiate)
wafer bonding part 1
2) Backgrind using conventional grind methods.
wafer bonding part 2
Thinned wafer is fully supported after backgrind operation for safe handling.
wafer bonding part 3
3) Bonded wafer stack is mounted to saw frame using standard wafer mounting systems.
wafer bonding part 4
4) Laser Irradiation - The laser debond creates microvoids in the LTHC layer allowing for separation between glass support and wafer.
Wafer bonding part 5
5) Remove Support - After laser debonding, the glass support lifts off easily and is cleaned and recycled for multiple uses.
wafer bonding part 6
6) Remove Adhesive - Adhesive layer removes easily, leaving minimal to no residue.
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Learn More About How Syagrus Can Help with Your Wafer Support Project

Syagrus Systems provides silicon wafer services including wafer bonding, wafer polishing, wafer backgrinding, and more.  Request a quote on temporary wafer bonding utilizing the 3M Wafer Support System, or contact Syagrus Systems for more information about our services.