Syagrus Systems Now Utilizing 3M Wafer Support System
Arden Hills, MN – Syagrus Systems is pleased to announce that it has entered into an agreement with 3M to provide silicon wafer thinning services utilizing the 3M™ Wafer Support System. As part of this agreement, Syagrus Systems will provide “ultra thin” wafer grinding services to the North American semiconductor industry as well as provide qualification runs and demonstrations to companies evaluating the 3M™ Wafer Support System.
The wafer support system replaces traditional backgrind tapes with a glass/adhesive sandwich that provides increased support during the crucial grinding step. As a result, manufacturers can create a much thinner wafer, with thicknesses down to 25 microns possible. And because the glass and adhesive construct can withstand high temperatures, it also allows the manufacturer to perform additional backside processing steps, if necessary.
The system works by coating a glass support carrier with a sacrificial light-to-heat decomposable layer and a top layer of 3M™ Liquid UV-Curable Adhesive. The cured adhesive fully supports the wafer edge and die topography, and holds much better than a simple tape. When the backside operations are complete, the sacrificial light-to-heat decomposable layer is bombarded with a laser, allowing the glass support to be separated from the wafer. The remaining adhesive layer is removed using a specialty tape, and the wafer is ready for additional processing.
About Syagrus Systems: Syagrus Systems Corporation, based in Arden Hills, Minnesota, is a leading manufacturing service provider to the worldwide semiconductor industry. The services offered by the company include SMD tape and reel, silicon wafer backgrinding, silicon wafer dicing, automated wafer inspection, and die sorting. Additional information can be found by visiting the Syagrus Systems website at www.syagrussystems.com