Syagrus Systems News

Syagrus Purchases New Machinery for Wafer Backgrinding and Dicing

Syagrus Systems recently purchased two new pieces of machinery—the DFG8540 in-feed surface grinder and the DFD6362 wafer dicer—that provide improved wafer dicing productivity and backgrinding performance.

Syagrus Systems and 3M, two Minnesota Companies working together to Utilize Wafer Support Systems with new agreement

Arden Hills, MN—Syagrus Systems is pleased to announce a new agreement with 3M allowing Syagrus to provide silicon wafer thinning services utilizing the 3M™ Wafer Support System (WSS). As part of this agreement, Syagrus Systems will provide “ultra thin” wafer grinding services to the North American semiconductor industry, as well as qualification runs and demonstrations to companies evaluating the WSS process.