DTS-1 Die Sorter

DTS-1 Die Sorter

Most Flexible & Accurate Die Sorter 

Key Features

  • Windows 10 OS. Small footprint of 1.2×0.97m

Input Formats

  • Die size from 0.1mm up to 45mm sq.
  • Die thickness as low as 12µm
  • Wafers up to 300mm / 12″
  • Waffle pack, Gel Pack and JEDEC trays
  • Bowl feeder

Output Formats

  • Invert or non invert
  • Wafers up to 300mm / 12″
  • Tape & reel – up to 44mm tapes
  • Waffle pack, Gel Pack and JEDEC trays


Vision Inspection Capability:

DTS-1 Die Sorter

  • Minimum defect size of 10µm for 12mm Die and even better on smaller Die
  • Top side, top & bottom side or 6 sided vision inspection.
  • Ability to inspect on all 6 sides:
  • Surface defects
  • Chipping and cracks
  • Bump inspection
  • Foreign material detection
  • Dimension measurement
  • Laser marking defects
  • OCR text or QR code recognition & mapping.

Ability to quickly switch over between regular top side inspection at full speed and 6 sided inspection.


Contact us for more information or a quotation