DTS-2 picking from wafer and placing into waffle pack 500um die at 10,600 UPH

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DTS-2 Die Sorter | Wafer Inspector Equipment Manufacturer
Die Pick and Place Equipment >> DTS-2 Die Sorter

DTS-2 Die Sorter

DTS-2 System

The DTS-2 dual-head die sorter is a high-quality machine that can produce wafer die to meet most production lines’ specifications. Using fully automated processes, this die sorting equipment separates wafers into categories based on pre-established characteristics. Using the DTS-2 machine to sort wafer die is a cost-effective way to achieve a high yield of wafers that perform as intended without cracks, chips, contaminations, or other issues.

Syagrus Systems manufactures the dual-head DTS-2 and the other die pick and place equipment your application requires for effective wafer packaging. We have the industry expertise to help you achieve your desired outcome from processing wafers to providing spare parts for die sorter equipment and beyond.

High Speed & Accurate Wafer Die Equipment

The DTS-2 dual-head die sorter can achieve up to 16,000 DPH throughput at +/-15µm accuracy, depending on the product. This wafer die sorting machine runs on Windows 10 OS (upgrades available) and supports all wafer map formats and SECS/GEM. The DTS-2 die sorter is equipped with a dual head and optional inverter for die transfer. It is suitable for cleanroom environments that meet Class 10,000 or Class 100 specifications.

For further technical die sorter machine specifications, see the DTS-2 die sorter system datasheet.

DTS-2 System Demo Statistics


DTS-2 System Process Control Plot


DTS-2 System Die to Die Spacing

DTS-2 System Die Theta Accuracy Chart

Input Specifications

DTS-2 dual-head die sorter equipment can auto load up to 300mm wafer frames from cassettes. Programmable automatic stretcher for the optional auto loads are included. Wafer map download is accomplished through a standard laser bar code reader or an optional 2D and QR bar code reader. Other input specifications include:

  • Die size from 0.2mm up to 45mmsq.
  • Die thickness as low as 12µm
  • Waffle pack, gel pack, and JEDEC trays

Output Specifications

The DTS-2 die sorter outputs wafer die with high accuracy at a fast speed. It features an optional 2D and QR bar code reader or the standard laser bar code reader for output mapping. Other output specifications include:

  • Wafers up to 300mm/12”
  • 2”, 3”, or 4” waffle pack, gel pack, and JEDEC trays

DTS-2 Wafer Die Machine Vision Inspection Capabilities

The DTS-2 die sorter machine achieves accurate die placement and sorting through innovative vision inspection capabilities. It detects defects at a minimum size of 10µm for 12mm die and even better on smaller die. Choose between top side, top and bottom side, to detect chips, cracks, and other flaws. Other capabilities include:

  • Bump inspection
  • Foreign material detection
  • Dimension measurement
  • Lasker marking defects
  • OCR text or QR code recognition and mapping

DTS-2 die sorting equipment comes standard with a 640x480 resolution camera. Optional upgrades to 1024x1400 or higher resolutions are available depending on your required defect size.


Contact Syagrus Systems for High-Quality Die Sorter Equipment


Syagrus Systems focuses on creating solutions for your problems and assisting you as you transition from engineering projects to establishing a full production line. In addition to the DTS-2 dual-head die sorter, we offer:



Contact us today with questions about our products or services. Request a quote when you’re ready to get started.