DTS-2 Die Sorter
The DTS-2 dual-head die sorter is a high-quality machine that can produce wafer die to meet most production lines’ specifications. Using fully automated processes, this die sorting equipment separates wafers into categories based on pre-established characteristics. Using the DTS-2 machine to sort wafer die is a cost-effective way to achieve a high yield of wafers that perform as intended without cracks, chips, contaminations, or other issues.
Syagrus Systems manufactures the dual-head DTS-2 and the other die pick and place equipment your application requires for effective wafer packaging. We have the industry expertise to help you achieve your desired outcome from processing wafers to providing spare parts for die sorter equipment and beyond.
High Speed & Accurate Wafer Die Equipment
The DTS-2 dual-head die sorter can achieve up to 16,000 DPH throughput at +/-15µm accuracy, depending on the product. This wafer die sorting machine runs on Windows 10 OS (upgrades available) and supports all wafer map formats and SECS/GEM. The DTS-2 die sorter is equipped with a dual head and optional inverter for die transfer. It is suitable for cleanroom environments that meet Class 10,000 or Class 100 specifications.
For further technical die sorter machine specifications, see the DTS-2 die sorter system datasheet.
DTS-2 dual-head die sorter equipment can auto load up to 300mm wafer frames from cassettes. Programmable automatic stretcher for the optional auto loads are included. Wafer map download is accomplished through a standard laser bar code reader or an optional 2D and QR bar code reader. Other input specifications include:
- Die size from 0.2mm up to 45mmsq.
- Die thickness as low as 12µm
- Waffle pack, gel pack, and JEDEC trays
The DTS-2 die sorter outputs wafer die with high accuracy at a fast speed. It features an optional 2D and QR bar code reader or the standard laser bar code reader for output mapping. Other output specifications include:
- Wafers up to 300mm/12”
- 2”, 3”, or 4” waffle pack, gel pack, and JEDEC trays
DTS-2 Wafer Die Machine Vision Inspection Capabilities
The DTS-2 die sorter machine achieves accurate die placement and sorting through innovative vision inspection capabilities. It detects defects at a minimum size of 10µm for 12mm die and even better on smaller die. Choose between top side, top and bottom side, to detect chips, cracks, and other flaws. Other capabilities include:
- Bump inspection
- Foreign material detection
- Dimension measurement
- Lasker marking defects
- OCR text or QR code recognition and mapping
DTS-2 die sorting equipment comes standard with a 640x480 resolution camera. Optional upgrades to 1024x1400 or higher resolutions are available depending on your required defect size.
Contact Syagrus Systems for High-Quality Die Sorter Equipment
Syagrus Systems focuses on creating solutions for your problems and assisting you as you transition from engineering projects to establishing a full production line. In addition to the DTS-2 dual-head die sorter, we offer: