Syagrus Systems provides leading edge semiconductor wafer grinding, dicing, inspection and pick and place packaging services to the electronics industry...worldwide.
Syagrus Systems is a leading service provider specializing in post-fab processes for semiconductor and electronic component manufacturers worldwide. We have become a leader in our business segment by listening to our customers' needs, working with them to create the solution and then exceeding their expectations. Let Syagrus Systems be part of your engineering team helping you bring your products to market faster and gain the competitive edge. Our focus is to help you transition your product from wafer form to usable die form quickly, meeting your critical deadline.
- Multi die or "Pizza Mask" Wafers
- Bumped Wafers
- Low Volume Engineering Runs