Backend Silicon Wafer Processing Services

Syagrus Systems

Syagrus Systems “consistently flexible" silicon wafer processing services are easily modified to your specifications while documenting each step for consistency and repeatability. We achieve quick cycle times without sacrificing quality, helping you bring products to market faster and gain a competitive edge.

With over 20 years of silicon wafer processing experience and quality-driven processes, we can achieve creative solutions where problems exist. Our expertise incudes:

  • Ultra-thin Wafer Backgrinding and Die Processing
  • Dicing
  • Wafer Bonding
  • Pick and Place/Die Sort Services
  • Multi-die or "Pizza Mask" Wafers
  • Bumped Wafers
  • Low Volume Engineering Runs
  • Pick and Place Equipment Manufacturing

Contact us to learn more about our services and discuss your project requirements.

Certified ISO 9001  Itar Registered logo


Silicon Wafer Services Driven by Precision and Quality

Tech companies and OEMs across a broad spectrum of industries rely on silicon wafer processing for prototypes and manufacturing. We proudly work with some of the industry's largest companies as well as the smallest innovative start-up and fabless semiconductor companies. Our customer base is extremely diverse and represents all segments of the semiconductor industry, including:

  • Military and Aerospace Technology
  • Telecommunications and Commercial Electronics
  • Medical Industry Electronics
  • RFID Communications


3M Wafer Support System / Temporary Wafer Bonding

The 3M wafer support system involves using a special UV-curable adhesive to temporarily bond silicon wafers to glass. This process minimizes stress and protects ultrathin wafers from damage during thinning and post-thinning applications.  

Automated Wafer Backgrinding

Fully automated Disco and Strasbaugh equipment helps us achieve superior quality and target thicknesses of less than 0.050mm (0.002”). We perform all SiC, fused silica, quartz, and silicon wafer backgrinding processes in a class 10K cleanroom.

Automated Wafer Dicing

Double pass or “step” cutting ensures high quality and accurate SiC, fused silica, quartz, and silicon wafer dicing. We can dice wafers as thin as 0.020mm (0.0008”) and up to 300mm (12.0”) in diameter with exceptional precision and repeatability.

Wafer Polishing

Chemical Mechanical Planarization (CMP) gently and effectively removes subsurface damage caused by backgrinding. We offer wafer polishing for freestanding thinned wafers and wafers that are still bonded to a carrier.

Automated and Manual Die Visual Inspection

Our inspection personnel are trained to MIL Std 883 specifications and use automated systems able to inspect full silicon wafers and sawn wafers on dicing frame. These systems can also import customer wafer maps and utilize ink dot recognition.

Automated and Manual Die Sort

We offer fully automated silicon wafer die sorting for projects ranging from single wafer prototype builds to high-volume production. Our automated die sort systems have device invert capability to prepare your product for automated manufacturing.

Silicon Wafer Die Sorting Equipment

Purchase new die sorting equipment for your facility. Our team develops, assembles, and sells new systems, including the DTS-I and DTS-II

Learn More About Our Semiconductor and Silicon Wafer Processing Services

Syagrus Systems is a full-service provider of silicon wafer and semiconductor backend processing. We also sell new sorting equipment and refurbish obsolete systems. Please contact us to learn more about our services and discuss your silicon wafer processing needs.

Now Offering New Wafer Die Sorting Equipment

Syagrus Systems recently acquired Taylor Tech, Inc., expanding our services to include die sorting equipment sales.

Military and Aerospace

Wafer thinning and post-fab semiconductor wafer processing for the military and aerospace industry, including wearable technology, surveillance systems, and other intelligence equipment.

Medical Electronics

Precise, class 10K cleanroom-controlled semiconductor and silicon wafer processing services for medical device OEMs.  

RFID Communications

Ultrathin wafer processing to thicknesses less than 0.050mm (0.002”) for RFID tags used in tracking and management applications.

Telecommunications and Commercial Electronics

Ultrathin silicon wafer processing and semiconductor backend processing for consumer and commercial electronics.