Syagrus Systems provides leading edge semiconductor wafer grinding, dicing, inspection and pick and place packaging services to the electronics industry...worldwide.

Syagrus Systems is a leading service provider specializing in post-fab processes for semiconductor and electronic component manufacturers worldwide. We have become a leader in our business segment by listening to our customers' needs, working with them to create the solution and then exceeding their expectations. Let Syagrus Systems be part of your engineering team helping you bring your products to market faster and gain the competitive edge. Our focus is to help you transition your product from wafer form to usable die form quickly, meeting your critical deadline.

  • Multi die or "Pizza Mask" Wafers
  • Bumped Wafers
  • Serialization
  • Low Volume Engineering Runs

A variety of services are provided to meet your needs. All services are designed to be "consistently flexible", in that we can easily modify our processes and react quickly to your needs while documenting each step for consistency and repeatability. Syagrus Systems customer base is very diverse and represents all segments of the semiconductor industry including telecommunications, military, and aerospace, medical and commercial. We proudly work with some of the industry's largest companies as well as the smallest innovative start-up and fabless semiconductor companies.

Our Wafer Services include:

We also provide a selection of services for your surface mount package die, such as:

Have questions regarding your application? Please contact us at Syagrus