Syagrus Systems Welcomes New Process Engineer Eric Wornson
Syagrus Systems is pleased to welcome Eric Wornson, who has been hired as our new Process Engineer. Wornson brings considerable experience and expertise to the role, having spent the last three-plus years as a research engineer with 3M Corporation.
Wornson earned his BS in Materials Science and Engineering from the University of Wisconsin-Madison in 2002. While working toward his degree, Wornson worked in various research labs, including the Applied Superconductivity Center and a Condensed Matter Physics group. His work with these organizations ranged from building sputtering chambers to energy conversion in polymer light-emitting diodes to friction measurements with atomic force microscopy. Wornson interned at Seagate in the read/write head division, looking at experimental sputtering techniques for low-friction surfaces.
During his time at 3M, Wornson worked directly with the Wafer Support System (WSS) group, for wafer-glass temporary bonding technology for very thin wafer applications. He also performed experimental work characterizing under-fill adhesives for 3D packaging, as well as investigating the performance of CMP processing materials.
As Syagrus Systems’ new Process Engineer, Wornson will focus on and specialize in silicon wafer thinning and 3M wafer bonding processes. He will also be developing and overseeing our new, soon-to-be-launched polishing center.