Wafer Dicing

Our fully automated wafer dicing systems consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems we know that a good wafer dicing process sets the pace for all remaining operations.  With a large variety of dicing blades in stock, we can optimize the wafer dicing process to achieve optimal yields for your critical devices.  We take pride in performing customized wafer dicing services for our customer base.  No job is too small or too large for Syagrus Systems.  Our wafer dicing systems are flexible enough to accommodate multi die or “pizza mask” wafers, as well as high volume programs. 

We can even perform wafer dicing operations on previously singulated multi die reticles and partial wafers.  To achieve the highest quality wafer dicing available, double pass cutting is our standard practice.  We successfully dice wafers as thin as .100mm (.004”) and up to 200mm (8.0”) diameter.  Syagrus Systems is continually trusted by some of the leading military and medical device manufactures for delivering defect free die, packed and prepared for automated assembly operations.

Our Wafer Dicing Services Offer:

• Same day cycle time available.
• .250" to 8" flexible dicing workspace capable of sawing multi die reticles.
• Singulated devices as small as .010”.
• Wafers as thin as .100 mm (.004”).
• Both bumped and non-bumped wafer dicing.  
• Large variety of dicing blades and tapes in stock to handle all customer requirements.
• Surfactant available.  
• Return shipment on saw frame, stretch rings, or continue to inspection and die sort.  
• Class 10k cleanroom  environment.
• Use our technical staff for your engineering and prototype runs, such as multi die or "pizza mask" wafers.