Wafer Backgrinding


Thin Wafer Backgrinding
Thin Wafer Backgrinding

Syagrus Systems features the 3M Wafer Support System, to meet the demand from today's technology companies for extremely thin silicon wafers and die used in complex applications. 

The Syagrus Systems team has over 15 years of silicon wafer thinning and wafer backgrinding experience.  All wafer backgrinding is performed in a class 10K cleanroom with critical thin wafer taping processes performed at a class 100 workstation.  We use fully automated Disco wafer backgrinding equipment to achieve the highest level of quality available and can continuously achieve thin wafer target thicknesses to less than .050mm (.002”).  To achieve these ultra thin thicknesses requires a grind wheel with an extremely fine diamond grit. This ultra fine grind wheel is our standard for all wafer grind target thicknesses and is a superior finish to the industry standard 2000 grit. Syagrus Systems stocks a wide variety of wafer backgrinding tapes so you can be assured we will have the correct tape for your application.

Bumped wafer backgrinding is nothing new to our process. We have been backgrinding bumped wafers since 1997.  Because timing is critical, we have streamlined our wafer backgrinding process so that you can enjoy same-day, 24 hour or 48 hour cycle times.  Syagrus Systems takes pride in partnering with today’s start up technology companies and has become the backend manufacturing arm for many fabless IC manufacturers.  Whether you have 1 wafer or 10,000 wafers that require thinning and backgrinding, we understand that your success is our success and we show appreciation for your business. 

Our custom backgrinding / wafer thinning service is capable of handling a wide variety of customer requirements, such as thinning partial wafers or single die.. and thinning the wafer is only one step in our process offerings. Through our supplier partners, we can also offer post grind stress relief processes such as SEZ etch and CMP.

Syagrus Systems can take your thin wafer all the way to singulated die form by allowing us to provide you with our professional wafer dicing services, automated die visual inspection services and wafer die sort services. 

Syagrus Systems Wafer Backgrinding / Wafer Thinning Services Provide:

  • Thin wafers from 4" to 8" diameter.
  • Ultra thin wafer backgrinding to target thickness of .025mm (.001").
  • Single die backgrinding.
  • Partial wafer backgrinding.
  • Bumped wafer backgrinding.
  • Same day cycle time.
  • Thickness variance under 5 microns.
  • Ultra fine grind wheels to obtain low stress polish or mirror like finish.
  • Wide selection of grinding tapes.
  • Use our engineering staff for your engineering and prototype runs.
  • Safe, damage resistant packaging to support thin wafer shipping.
  • Class 10k cleanroom environment.