Wafer Die Sorting & Pick-and-Place Services
Precision wafer die sorting is a post-fab process that involves inspecting electrically good die for visual defects. Passing die are then separated and sorted from failing die based on pre-set characteristics. Syagrus Systems offers fully automated die sorting services to complement our wafer dicing and inspection processes. Our specialties and capabilities include:
- Working with die less than 50μm in thickness
- 3” to 8” wafer diameter capability
- Ultrathin and multi-die binning
- Pizza Mask wafer die sort services
- Inverting capabilities for bumped devices
- Various pick tips and needle configurations available to handle your die sorting requirements
- Ability to import wafer maps or work with ink dot recognition
- Embossed SMD tape and reel, Gel Pak®, and chip tray outputs
- Customized labeling and drop shipping
Whether you require a high-volume production or a single wafer prototype build, we have the die sorting solution for you. Contact us or request a quote to begin your die sort service.
How Wafer Sort Processes Improve Your Production
Known good die are an essential component of semiconductor manufacturing processes. High production demand leads to a need for increased production yields. Despite a manufacturer’s best efforts, not all chips on a wafer are functional or share the same characteristics. Die sort and wafer sort services allow you to harvest only known good die and package them for future automated manufacturing processes. Also known as wafer pick-and-place or wafer plating, wafer die sorting processes minimize waste while maximizing yield.
Precision Wafer Sort Services from an Experienced Manufacturer
Semiconductor die sort services require incredible precision to place die in the correct orientation for packaging. You need a company with the expertise to achieve the highest yield possible while providing various packaging solutions to meet your size and output requirements. You need Syagrus Systems.
Our trained personnel use automated and manual wafer sorting systems to achieve the best results and complete your project on time. Packaging is performed per your requirements and offered in a variety of outputs, including:
- Chip Tray or Waffle Pack Services
- Gel Pak® Services
- “Chip On Tape” or COT, reconstituted wafer array
- Embossed Carrier Tape (Surface Mount Device Tape and Reel Services)
We also provide vacuum seal dry packaging, customized labeling, barcoding, and drop shipping services. Call 651-683-2220 to learn more about our die sort packaging options.
Wafer Sort & Other Die Services for Industrial Manufacturers
Different industries have varying requirements, and Syagrus Systems has the expertise to meet the demands of most markets quickly and accurately. To complement your wafer sort process, we provide a range of other wafer services to add value, efficiency, and operational capacities to your OEM or other semiconductor manufacturing production:
Achieve Quality & Accurate Yields with Wafer Die Sorting Services from Syagrus
Syagrus Systems is the premier provider of wafer die sorting solutions. In addition to our die sort services and wafer sort processes, we also manufacture high-quality die pick-and-place equipment to enhance your own manufacturing line. No matter your order or needs, we always work hard to ensure your complete satisfaction through strict quality assurance protocols, excellent services, and ongoing communication throughout your production.
Contact us today to learn more about our products and capabilities. Request a quote to receive information directly related to your order. A wafer die sorting expert will be in touch as soon as possible.
