Additional Wafer Capabilities

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To complement our wafer backgrinding, wafer dicing, and other wafer processing services, we offer a number of additional capabilities. These secondary services help us deliver silicon wafers that better match the requirements of our customers, reducing or eliminating the need for further processing—we do more of the work so you don’t have to.

Syagrus SEZ® Etching Process

Performed following the wafer backgrinding process, SEZ etching removes additional silicon from the back of the wafer and eliminates subsurface micro damage created by the grinding wheel. Specially engineered to provide optimum uniformity control, repeatability, and selectivity to underlying materials, this process results in an ultra-thin wafer with a uniform, stress-free surface. This back-end-of-the-line (BEOL) process includes:

  • Post-ash clean
  • Backside/bevel etch/clean
  • Substrate etch


Thin Film Deposition

  • RF diode and DC magnetron sputtering
  • Thermal and e-Beam evaporation
  • CVD and ALD
  • Basic metals: chromium, titanium, tungsten, iron, nickel, aluminum, indium, and more
  • Precious metals: gold, silver, platinum, and more
  • Dielectrics: silicon dioxide, silicon nitride, aluminum oxide, aluminum nitride, titanium nitride, glasses, and more
  • Alloys: CoCr (cobalt-chrome), NiFe (iron-nickel), NiCr (nickel-chromium/nichrome), PtIr (platinum-iridium), and more
  • Solder bumping: indium and eutectic gold-tin alloy
  • Contact Syagrus Systems Today for more information on Thin Film Deposition

Syagrus Does Photolithography

  • Front side/back side alignment
  • Wafer sizes up to 150mm; 200mm can be processed by dicing into quarters
  • Feature size down to 1µm
  • Lift-off processing and wet- and dry-etch (RIE, DRIE, iron mill)

Post-Metallization Annealing

  • Wafer size up to 200mm
  • Atmospheric, vacuum, inert, and forming gas (up to 15% H2)
  • Want to Learn More About Post Metallization Annealing and how it can benifit your company? Contact Syagrus Systems Today

Metrology

  • SEM, FIB, XRF, EDS, AFM

Compound Semi Dicing, Grinding & Polishing

 

  • 0.25" (6.35mm) to 8" (200mm) flexible wafer dicing workspace capable of sawing multi-die reticles

 

Contact Syagrus with any questions on secondary wafer services today!

Contact Syagrus Systems today for more information on our secondary wafer processing services.


Check out other additional wafer services offered by Syagrus: