Surface Mount Device Tape and Reel

Syagrus Systems specializes in high mix low volume surface mount device tape and reel packaging to support component distributors and OEM's.  Syagrus Systems offers the highest quality SMD tape and reel packaging services available and at a lower cost than most companies can obtain from internal operations.  Our standard SMD tape and reel packaging meets or exceeds EIA standards.  Our documentation and traveler process allows for your special requirements to be easily integrated into our standard flow. 

To compliment our surface mount device tape and reel packaging, we also offer component bake and dry packaging services.  We understand that customers do not need unpleasant surprises; therefore, all reels are 100% inspected prior to shipment.  Custom carrier tape tooling is available for those devices in which a carrier tape does not currently exist.

Surface Mount Device Tape and Reel Offers:

• Flip Chip, Bare die tape and reel.
• Fast order turn around: Same-day, 1-day, and 3-day standard.
• SOIC, PLCC, TQFP, BGA, TSSOP, SOJ, MCM's, Capacitors, DPak, and many others.
• Component bake and dry packaging service.
• All packaging meets or exceeds EIA standards and customer specifications.
• Computerized peel force testing and certificate of compliance with each order.
• Conductive and antistatic packaging materials.
• Humidity and temperature controlled environment.
• ESD protected environment.
• Custom carrier tooling and packaging.
• Custom bar code and human readable labeling.